Communication detection capability
Electromagnetic Radiation Detection
Product range | Detection standard |
Communication base stations, substations, etc | " Environmental Electrical Wave Health Standards" GB 9175-1998 " Regulations on Electromagnetic Radiation Protection" GB8702-1988 " Guidelines for Radiation Environmental Protection Management - Electromagnetic Radiation Monitoring and Methods" HJ/T10.2-1996 " Guidelines for Radiation Environmental Protection Management - Methods and Standards for Electromagnetic Radiation Environmental Impact Assessment" HJ/T10.3-1996 " Methods for Electromagnetic Radiation Environmental Monitoring of Mobile Communication Base Stations"< br/> |
Wireless monitoring equipment monitoring
Type | Detection items | Detection standard |
Electrical performance | demodulation sensitivity, monitoring sensitivity, frequency tuning resolution, frequency accuracy, intermediate frequency selectivity, third-order cutoff point, etc | GB/T 32401-2015 Technical requirements and testing methods for VHFUHF frequency band radio monitoring receivers |
Electromagnetic compatibility | Power terminal disturbance voltage, radiation disturbance emission | GB/T 34089-2017 VHFUHF Radio Monitoring and Direction Finding System |
Electrical safety | Opening test parameters and testing methods | |
Environmental adaptability | low temperature, High temperature, temperature change, impact, vibration, damp heat, dripping water | GB 4824, GB 4793.1, GB/T 2423 |
Quality and reliability of electronic products
Type | Detection items |
Communication chip reliability verification | New product NPI import reliability verification (PC/HAST/THB/HTSL) Chip level ESD (HBM/CDM/LU) testing IP ESD capability design verification Aging life verification Process risk assessment verification |
Electrical performance and functional testing | Chip level testing and three temperature verification (room temperature/low temperature/high temperature) |
Process quality evaluation | Competitive analysis PCB/PCBA metallographic section testing X-ray perspective testing Product batch failure analysis Non destructive testing analysis |
SOC chip failure analysis | Electrical performance analysis Sample failure analysis Precision microscope analysis |
Communication Equipment Test
1, Environmental and reliability testing
Test item | Temperature test, high temperature, humid heat, low temperature, temperature cycle, rapid temperature change, temperature shock, high acceleration screening test, moisture resistance, salt spray, rain, sand and dust test, high-altitude low-pressure test, vibration, drop, immersion, mechanical shock, high acceleration shock, xenon lamp test, ultraviolet irradiation, sunlight test, fiber optic pressure test, fiber optic torsion test, collision test, gas corrosion test |
2, Electromagnetic compatibility test
Test item | Test standard |
Conducted Disturbances (CE) Radiated Disturbances (RE) Electrostatic Discharge Immunity (ESD) Radio Frequency Radiation Immunity (RS) Electrical Fast Transient (EFT) Surge Conducted Disturbances Induced by Radio Frequency Fields (CS) Power Frequency Magnetic Field Immunity (PFMF) Pulse Magnetic Field Immunity (PMF) Voltage Transient, Short Interruption, and Voltage Variation Immunity DIP | CISPR 32/35 (EN 55032/35) ETSI 301 489 series EN 300 386 IEC 61000-4-2/-3/-4/-5/-6/-8/-11 IEC 61000-3-2/-3 ITU-T K.20/21 (K.44/45) GB 9254 GB 19286 YD/T 993 GB/T 17626.2/.3/.4/.5/.6/.8/11 GB 17625.1/2 |